Student Monitoring the heat accumulation during fabrication of surface micropatterns on metallic surfaces using Direct Laser Interference PatterningFriday (26.06.2020) 11:30 - 11:50 Room 3
Today, it is known that laser technologies are outstanding in creating functional surface structures, reproducing stunning natural examples as water repellent and the self-cleaning effects of the lotus leaf .
A relatively new laser-based method capable of functionalizing surfaces is Direct Laser Interference Patterning (DLIP). This method allows producing periodic micropatterns on different materials with high throughput using either fs, ps or ns laser pulses. Like in other techniques utilizing short and ultra-short laser pulses, the physical mechanisms involved in the interaction between ultrashort laser pulses and solid matter depend on material properties as well as the laser processing parameters. One of the most interesting and relevant physical effect, which can be observed during the laser treatment, is the heat accumulation at the material, since it has a significant influence on the condition of the process results.
In this study, heat accumulation effects induced by a DLIP process are investigated using an uncooled high-speed mid-wave infrared (MWIR) camera in an off-axis configuration. The used laser process set-up consists of a pulsed laser source delivering picosecond pulses combined with a modular DLIP head, which is mounted on a positioning stage system for moving the sample during the laser treatment (Figure 1a). By using this two-beam configuration, line-like periodic structures with a spatial period of some µm were produced on different metallic sheets including stainless steel and aluminium. The MWIR camera was utilized to monitor the accumulated heat during the processing of the samples varing different parameters as laser power and repetition rate. The obtained results reveal a correlation between the recorded signal and the surface quality (Figure 1b). The processed samples are characterized using confocal microscopy (CM) and scanning electron microscopy (SEM).
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