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Student Direct and indirect glass texturing employing interference-based methods

Wednesday (24.06.2020)
15:10 - 15:30 Room 3
Part of:

The processing of transparent materials by lasers often involves the use of high power ultraviolet sources or ultrashort pulsed laser in order to take advantage of non-linear absorption mechanisms for surface structuring. Moreover, applications such as decoration, wettability or antibacterial properties necessitate textures with sizes in the micro- or submicrometer range [1,2]. In the last 10 years, Direct Laser Interference Patterning (DLIP) has become increasingly important as a micromachining technique, thereby periodic microstructures can be generated by the coherent superposition of two or more laser beams [3].

In the present work, soda lime glass has been textured through DLIP employing direct and indirect approaches using ultrashort-pulsed (10 ps) green (532 nm) and a short-pulsed (15 ns) infrared

(1053 nm) lasers, respectively. In the first case, the glass substrate, which is completely transparent at the used laser wavelength, could be selectively ablated by a direct processing approach by means of non-linear absorption processes. With a proper selection of the laser fluence dose, periodic dot-like and line-like structures with spatial periods ranging from 2.3 µm to 9.0 µm could be realized employing two- and four-beam DLIP configurations. Moreover, laser induced periodic surface structures could be observed in the ablated areas of the glass surfaces (Figure 1a).

For the indirect texturing, the glass substrates have been textured employing the Backside Etching (BSE) technique properly combined with a DLIP setup (BSE-DLIP). In BSE, an absorber material is placed underneath the sample’s surface. The incident laser radiation on the absorber material leads to plasma formation which etches the backside of the target glass material. Two and four beam DLIP setups have been used to produce periodic dot-like and line-like structures, respectively, with spatial periods ranging from 1.5 µm to 10.0 µm (Figure 1b).

Sabri Alamri
Fraunhofer Institute for Material and Beam Technology IWS Dresden
Additional Authors:
  • Paul A. Sürmann
    Fraunhofer IWS, Fraunhofer-Institut für Werkstoff- und Strahltechnik
  • Prof. Dr. Andrés F. Lasagni
    Technische Universität Dresden
  • Dr. Tim Kunze
    Fraunhofer IWS, Fraunhofer-Institut für Werkstoff- und Strahltechnik


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