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Fs laser micro-machining in glass

Wednesday (24.06.2020)
14:50 - 15:10 Room 3
Part of:

Femtosecond laser are more and more used to machine glass. Indeed, this technology is used in the field of micro-fluidics to make channels and weld, or to cut smartphone screen. This process find application for Lab on chips as well. In this work, a process to make channels on glass, welding and cutting is demonstrated on a industrial machine made by LASEA integrating a special optical module developed by Amplitude. Initially the laser beam has a gaussian distribution. It is then transformed in Bessel intensity profile. Consequently, the focus area is elongated to form a filament allowing to cut glass up to more than 500 µm thick. This module was developed especially for cutting applications. In this work we develop the process to extend the field of applications to welding and micro channels manufacturing. The system is combined with burst mode allowing to reach 400 µJ per burst containing 10 pulses. The laser parameters are tuned according to the application. We have welded micro channels and sealing has been investigated in the channels by injecting ink showing no leakage. The huge advantage of this process is the continuous and elongated melted area and consequently less sensitive to the tilt or other mechanical misalignments. Micro channels were produced with dimensions from 30 µm to 100 µm deep, and of about 200 µm wide. The best roughness achieved was down to 300 nm. According to the process conditions, we can have different profiles of the channel such as square or rounded. This could be an advantage regarding microfluidics in terms of turbulences when a flow is passing through the channels. We assessed the cutting of different shapes with thicknesses from 300 µm up to 1 mm. The demonstration of welding, cutting and micro channels ablation has been achieved on the same machine for different applications such as smartphone screen cutting, microfluidics channels, etc...

Additional Authors:
  • Dr. David Bruneel
  • Dr. José A. Ramos-de-Campos
  • Axel Kupisiewicz