Electrical activation of polymer Reny1002H surface with laser irradiation for MIDThursday (25.06.2020) 16:20 - 16:40 Room 2
In this study, Mitsubishi polymers Reny 1002H blended with 3% by weight Merck Iriotec 8841 (dicopper hydroxide phosphate) after injection molding was irradiated using a CO2 laser and copper electroless plated. It has been observed that the surface activation was clearly determined by the interaction between laser and resin material, which was further determined by the laser power, scanning speed and line hatching pitch. With increasing laser scanning speed, naturally the modification level was reduced, and electrical resistance was reduced. Line pitch played a similar function to scanning speed. At increasing line hatch spacing, especially close or larger than the laser spot size, the surface was not able to be modified uniformly. Electrical resistance decreased increasing laser power as modification level of Reny surface stronger at high laser power as shown in Figure 1. The surface morphology under laser irradiation was shown in Figure 2(a). The copper plated surface was shown in Figure 2(b). It indicates a porous surface structure as such the measured electrical resistance was 0.043 Ohms. The calculated electrical resistivity was 1.62 ×10-7 Ωm which was one order of magnitude lower than the bulk copper of 1.72 ×10-8 Ωm due to the porous structure.
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