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Lecture

Student In-depth comparison of glass processing using laser-based and conventional methods

Wednesday (24.06.2020)
14:30 - 14:50 Room 3
Part of:


Conventional glass processing techniques, such as mechanical scribing and separation, are currently being replaced by new emerging laser-based techniques due to higher precision, speed, flexibility and quality thanks to the precise laser pulse energy deposition into the material. However, the emerging techniques have to be validated comparing to conventional processing. For this, we introduce comparative investigation of the five different glass processing techniques – laser-based and mechanical dicing, rear-side laser machining, diamond saw cutting and waterjet cutting.

The glass dicing and the subsequent mechanical separation is a highly efficient method. However, to minimise the braking force of the modified sheets, the modifications along the full thickness of the material are required. Furthermore, the process throughput depends on the intra-distance between laser-induced modifications along the cutting path. Therefore, we have introduced elliptical Bessel beams with a long non-diffractive length and elliptical intensity distribution, which generates transverse cracks in the bulk of the material. As a result, the more uniform cleavage plane with the reduced braking force, better surface quality and lower side-wall roughness were achieved during the breakage. In the experiments, the high pulse energy sub-nanosecond laser was used. The elliptical intensity distribution was generated using the oblate-tip axicon with an elliptical cross-section. However, the ellipticity of the intensity pattern could be controlled via axicon tilt operation or using amplitude masks, as well. However, when the complex shape cutting is required, rear-side laser machining can offer much more flexibility. In the case of the tightly focused nanosecond pulses, the material is locally fractured into small parts, having the dimension of tens to hundreds of micrometers. Therefore, high material removal rates can be achieved.

In this work, we present results on the in-depth comparison of 1 mm-thick soda-lime glass cutting processes in terms of the surface chipping, side-wall roughness, residual stress and flexural strength of the fabricated parts.

Speaker:
Juozas Dudutis
Center for Physical Sciences and Technology FTMC
Additional Authors:
  • Jokūbas Pipiras
    State research institute Center for Physical Sciences and Technology
  • Rokas Stonys
    State research institute Center for Physical Sciences and Technology
  • Eimantas Daknys
    State research institute Center for Physical Sciences and Technology
  • Dr. Gediminas Račiukaitis
    State research institute Center for Physical Sciences and Technology
  • Dr. Paulius Gečys
    State research institute Center for Physical Sciences and Technology

Dateien

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Extended Abstract Version 1 Conventional glass processing techniques, such as mechanical scribing and separation, are currently being replaced by new emerging laser-based techniques due to higher precision, speed, flexibility and quality thanks to the precise laser pulse energy deposition into the material. However, the emerging techniques have to be validated comparing to conventional processing. For this, we introduce comparative investigation of the five different glass processing techniques – laser-based dicing, using asymmetrical Bessel beam, mechanical dicing, rear-side laser machining, diamond saw cutting and waterjet cutting – in terms of the surface chipping, side-wall roughness, residual stress and flexural strength of the fabricated parts. 107 KB Download