Picosecond laser ablation of borosilicate glass plates through the thin flowing water layerWednesday (24.06.2020) 16:50 - 17:10 Room 3
Small-sized and complex glass elements are frequently used in compact lasers, wave-meters or microfluidic devices. Modern picosecond duration lasers have become a promising tool allowing fast and high-quality cutting of thin glass substrates. The highest cutting rates are achieved via the rear side drilling, stealth dicing, and the direct ablation techniques. The rear side drilling generates large cracks reaching hundreds of micrometres in size, while the stealth dicing suffers from the cut geometry limitations, especially, in case of small-sized elements. This makes the direct laser ablation the most versatile approach, allowing high processing quality and cutting of complex shapes. However, it is the slowest out of three: the slow cutting speed is the main drawback of the direct ablation approach limiting its broader application in the industry. Fortunately, studies have shown that the processing rates can be significantly improved in various materials (metals, semiconductors, and dielectrics) when the water layer is introduced into the laser ablation zone.
In this work, 10-ps pulse duration and high pulse repetition rate (1 MHz) laser working at 355 and 1064 nm wavelengths was used in the direct ablation and cutting experiments of the commercially available 400 µm thick borosilicate glass plates. Efficient ablation of the grooves and complete cutting of glass plates were investigated in ambient air and water-assisted conditions at different laser pulse repetition rates (ranging from several tens of kHz to up to 1 MHz). Results revealed improved ablation efficiency, glass cutting rates and processing quality when the ablation took place in the water-assisted conditions.
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