Quality and efficiency of GHz femtosecond processingWednesday (24.06.2020) 16:10 - 16:30 Room 1
Ablation of lines and cavities using high power GHz femtosecond lasers achieves high specific removal rates up to 5.9 mm3/min/W in the case of aluminum and 5.55 mm3/min/W in the case of silicon. The efficiency increase can be explained by the combination of non-thermal and thermal nature of the laser-matter interaction. In this work we study the impact of the efficiency gain on the obtained processing quality.
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