193 nm Laser Processing of Ceramic Matrix Composites (CMC)Thursday (25.06.2020) 17:40 - 18:20 Room 1
Laser processing is widely applied for various devices and systems such as vehicles, smartphones, flat panel displays (FPD), thin film photovoltaic panels, and so on.
One of recent trends of laser processing is to use a deep ultra-violet (DUV) laser such as a high-power excimer or a hybrid laser [1-5]. DUV laser processing could reduce thermal influence and damage in a material by direct photon absorption because photon energy of DUV is much higher than that of infrared lasers.
Laser processing of composite materials has been widely studied for weight-reduction of airplanes and vehicles. Recently, ceramic matrix composites (CMC), composed of SiC fiber and SiC matrix (SiC/SiC), to application to jet-engine turbine blade is strongly required because of more than the airplane weight-reduction and its fuel economy improvement . However, it is well-known that productivity of conventional CMC processing is extremely lower than that of other airplane component materials.
In this work, 193 nm lasers processing of CMC (SiC/SiC) was examined to investigate laser wavelength and processing atmosphere. An 193 nm (ArF) excimer laser and an 193 nm hybrid laser for drilling and cutting were used. Laser processing samples were observed by use of optical microscope, laser microscope, scanning electron microscope (SEM) and X-ray computed tomography (CT).
We examined ablation characteristics on CMC in 193 nm laser drilling with pulse duration of 20 ns (excimer laser) and 460 ps (hybrid laser) at the same fluences of 2 J/cm2. The removal rate in the case of 460 ps was 4 times faster than that of 20 ns because of the high peak intensity of the hybrid laser beam .
This work is supported by New Energy and Industrial Technology Development Organization (NEDO).
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